YSB55w

YSB55w

FLIP CHIP BONDER: YSB55w Back to flip chip bonder overview  → The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new...
i-Cube10

i-Cube10

FLIP CHIP BONDER: i-Cube10 Back to flip chip bonder overview  → Realize mixed mounting of semiconductor and SMD Features of YSH20 4,500 UPH (0.8 sec/unit); the top mounting capability in semiconductor manufacturing flip chip bonding +/- 10 µm (3σ) mounting...