HYBRIDER BESTÜCKUNGSAUTOMAT: YSB55w

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The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new era in semiconductor packaging for the expanding flip chip market.

Features of YSB55w

  • High bonding accuracy and x3 productivity of conventional machines!
    This brings a new era in semiconductor manufacturing packaging for the expanding flip chip market.
  • High-speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
  • High-accuracy: ±5μm (3σ)
  • High-quality & flexibility


Specifications

Modell YSB55w
  • Applicable substrate
 L 240 x W 200 to L 50 x W 50 mm
  • Substrate thickness
 0.2 to 3.0 mm
  • Transport direction
 Left to Right (option : Right to Left)
  • Bonding accuracy
 ±5 µm (3σ) (When using Yamaha’s standard components)
  • Throughput
 13,000 UPH (Including processing time)
  • Applicable wafer size
 12 inch wafer
  • Applicable die size
 □2 to 30 mm
  • Spannungsversorgung
 3-Phase AC 200/208/220/240/380/400/416 V ± 10 % 50/60 Hz
  • Air supply
 0.45 MPa or more
  • External dimension
 L 2,090 x D 1,866 x H 1,550 mm (YSB55w main unit & wafer feed unit)
  • Gewicht
 Approx. 3,600 kg (YSB55w main unit & wafer feed unit)

Die Spezifikationen und das Erscheinungsbild können ohne vorherige Ankündigung geändert werden.
Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.