INSPEKTIONSLÖSUNGEN: YSi-SP
The SMT YSi-SP high-speed 3D Solder Paste Inspection machine is the long-awaited SPI from Yamaha: the YSi-SP is a high-speed 3D solder paste inspection machine that enables high-speed, high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections.
Features of YSi-SP
- SPI with “1-head solution” to perform various inspections with a single head
- Top test equipment that achieves high-accuracy high-speed inspections using 3D + 2D inspection, image resolution switch-over and more
- A thorough and extensive machine-to-machine (M2M) solution
- Statistical Process Control (SPC) for diverse statistical processing
- Optional features to enable handling various products
Specifications
| Modell | YSi-SP | |
|---|---|---|
| Applicable PCB | L 510 x W 460 mm to L 50 x W 50 mm (single lane spec) | |
| *No dual lane specification available. | ||
| Horizontal resolution (FOV size) | 1）25 µm / 12.5 µm (approx. 50 x 50 mm) 2）20 µm / 10 µm (approx. 40 x 40 mm) 3）15 µm / 7.5 µm (approx. 30 x 30 mm) *All are standard selection type. |
|
| Height resolution | 1 µm | |
|
Solder paste printing quality (volume, height, area and misalignment) | |
|
Single-phase AC 200 V–230 V ±10 % | |
|
Airless specification | |
|
L 904 x W 1,080 x H 1,478 mm | |
|
Approx. 550 kg | |
Die Spezifikationen und das Erscheinungsbild können ohne vorherige Ankündigung geändert werden.
Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.