Realize mixed mounting of semiconductor and SMD

Features of YSH20

  • 4,500 UPH (0.8 sec/unit); the top mounting capability in semiconductor manufacturing flip chip bonding
  • +/- 10 µm (3σ) mounting accuracy
  • YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable
  • 0.6 × 0.6 mm to 18 × 18 mm components applicable

Specifications

Modelle YSH20
Applicable PCB L 50 x W 30 mm to L 250 x W 200 mm
** “Up to L 340 x W 340 mm” is applicable. Please contact us separately.
  • Mounting accuracy (when using Yamaha’s standard components)
[2F2F heads & multi-camera type]Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree
[4M4M heads & multi-camera type] ** under development
Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree
  • Mounting capability (under optimum condition)
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** excluding dipping 3,600 UPH (1.0 sec/unit) ** including dipping
[4M4M heads & multi-camera type] ** under development 5,500 UPH (0.65 sec/unit) ** excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping
Component supply configuration Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width)
Applicable components [multi-camera] flipchip: 0.6 x 0.6 mm to 18 x 18 mm bump diameter 60 μm or more bump pitch 110 μm or more, H 0.7 mm or less
SMD Chip: 0402 (metric base) to 20 x 20 mm, H 6mm or less
Power supply 3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz
Air supply source 0.5 MPa or more, in clean, dry state
External dimension
** excluding projections
L 1,400 x W 1,820 x H 1,515 mm (main unit only)
L 1,400 x W 2,035 x H 1,515 mm (when YWF wafer supply unit is installed)
Gewicht Approx. 2,470 kg (main unit only)
Approx. 2,780 kg (when YWF wafer supply unit is installed)

Die Spezifikationen und das Erscheinungsbild können ohne vorherige Ankündigung geändert werden.
Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.