MOUNTER: S20

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The Yamaha S20 is the revolution for pick & place production. It offers ultimate flexibility with its revolutionary Color fiducial camera and the enhancement to 3D hybrid modular mounter. The S20 has the capability to handle large PCB and a wide range of assembly components.

Features of S20

  • Unique 3D MID assembly module
  • Production Revolution Ultimate flexibility Color fiducial camera
  • Max. feeder capacity 180 lanes
  • Large board handling capability
  • Wide range component handling capability
  • CFB/CTF full compatibility

Specifications

Model S20
  • Board size
    (with buffer unused)
 Min. L 50 x W 30 mm to Max. L 1,830 x W 510 mm (Standard L 1,455)
  • Board size
    (with input and output buffers used)
 Min. L 50 x W 30 mm to Max. L 540x W 510 mm
  • Board thickness
 0.4 – 4.8 mm
  • Board flow direction
 Left to right (Std)
  • Board transfer speed
 Max 900 mm/sec
  • Placement speed
    (12 heads + 2 theta) Opt. Cond.
 0.08 sec/CHIP (45,000 CPH)
  • Placement accuracy A (μ+3σ)
 CHIP +/- 0.040 mm
  • Placement accuracy B (μ+3σ)
 IC +/- 0.025 mm
  • Placement angle
 +/- 180 degrees
  • Z axis control/ Theta axis control
 AC servo motor
  • Component height
 Max 30 mm*1 (Pre-placed components: max 25 mm)
  • Applicable components
 0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
  • Component package
 8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
  • Drawback check
 Vacuum check and vision check
  • Screen language
 English, Chinese, Korean, Japanese
  • Board positioning
 Board grip unit, front reference, auto conveyor width adjustment
  • Component types
 Max 180 types (8 mm tape), 45 lanes x 4
  • Transfer height
 900 +/- 20 mm
  • Machine dimensions, weight
 L 1750 x D 1750 x H 1420 mm, Approx. 1450 kg
*1) Board thickness + Component height = Max 30mm

Specifications and appearance are subject to change without prior notice.