MOUNTER: S10

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The Yamaha S10 is the revolution for pick & place production. It offers ultimate flexibility with its revolutionary Color fiducial camera and the enhancement to 3D hybrid modular mounter. The S10 has the capability to handle wide ranges of assembly components.

Features of S10

  • Unique 3D MID assembly module
  • Production Revolution Ultimate flexibility Color fiducial camera
  • Max. feeder capacity 180 lanes
  • Large board handling capability
  • Wide range component handling capability
  • CFB/CTF full compatibility


Specifications

Model S10
  • Board size
    (with buffer unused)
 Min. L 50 x W 30 mm to Max. L 1,330 x W 510 mm (Standard L 955)
  • Board size
    (with input or output buffers used)
Min. L 50 x W 30 mm to Max. L 420x W 510 mm
  • Board size
    (with input and output buffers used)
Min. L 50 x W 30 mm to Max. L 330x W 510 mm
  • Board thickness
 0.4 – 4.8 mm
  • Board flow direction
 Left to right (Std)
  • Board transfer speed
 Max 900 mm/sec
  • Placement speed
    (12 heads + 2 theta) Opt. Cond.
 0.08 sec/CHIP (45,000 CPH)
  • Placement accuracy A (μ+3σ)
 CHIP +/- 0.040 mm
  • Placement accuracy B (μ+3σ)
 IC +/- 0.025 mm
  • Placement angle
 +/- 180 degrees
  • Z axis control/ Theta axis control
 AC servo motor
  • Component height
 Max 30 mm*1 (Pre-placed components: max 25 mm)
  • Applicable components
 0201 mm – 120 x 90 mm, BGA, CSP, connector, etc.
  • Component package
 8 – 56 mm tape (F1/F2 Feeders), 8 – 88 mm tape (F3 Electric Feeders), stick, tray
  • Drawback check
 Vacuum check and vision check
  • Screen language
 English, Chinese, Korean, Japanese
  • Board positioning
 Board grip unit, front reference, auto conveyor width adjustment
  • Component types
 Max 90 types (8 mm tape), 45 lanes x 2
  • Transfer height
 900 +/- 20 mm
  • Machine dimensions, weight
 L 1250 x D 1750 x H 1420 mm, Approx. 1150 kg
*1) Board thickness + Component height = Max 30mm

Specifications and appearance are subject to change without prior notice.